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Analysis of Trends in the Localization of Optical Module Chips

Analysis of Trends in the Localization of Optical Module Chips

2026-10-13
How far come in optical module chip localization? Optical module chip localization trends: China leads in module assembly but trails in high-end EML, DSP, and InP substrates.
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Analysis of Global AI Computing Power Development Trends

Analysis of Global AI Computing Power Development Trends

2026-10-10
AI computing trends 2026: from training to inference, from GPU to diversified accelerators, and from 800G to 1.6T optical modules. Full global market analysis inside.
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800G OSFP Package Comparison: RHS vs. IHS

800G OSFP Package Comparison: RHS vs. IHS

2026-10-09
800G OSFP package comparison: IHS integrated heatsink vs RHS riding heatsink. Understand cooling methods, port density, and why RHS is trending for 1.6T and liquid cooling.
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100G QSFP28 Optical Module Features and Selection Analysis

100G QSFP28 Optical Module Features and Selection Analysis

2026-10-08
100G QSFP28 optical module selection guide: compare SR4, CWDM4, LR4, ER4, ZR4, eZR4 and more. Learn how to choose by fiber, connector, distance, and budget.
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The Connection Between PCB and AI (Supplement Part)

The Connection Between PCB and AI (Supplement Part)

2026-09-30
the true high-value core and high-barrier track in the AI and PCB industry chain is not conventional high-speed boards, but rather IC packaging substrates, which have long been underestimated and...
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In-Depth Analysis of Industry Policies for Optical Modules

In-Depth Analysis of Industry Policies for Optical Modules

2026-09-28
Deep dive into China's optical module industry policy: 800G/1.6T mandates, CPO/LPO technology roadmap, and national/local subsidy programs.
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Part Ⅱ: What is the Value of PCB in the AI ERA

Part Ⅱ: What is the Value of PCB in the AI ERA

2026-09-23
How does AI drive PCB upgrades? From high-frequency CCL to HDI and COB packaging, discover the materials and technologies behind AI server PCBs.
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Part I: The Relationship Between PCB and AI

Part I: The Relationship Between PCB and AI

2026-09-21
Why can one AI server PCB cost 1,000x more than a consumer board? Explore how AI computing is driving PCB value, HDI demand, and IC substrate growth.
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25G BIDI 80km Optical Module - The Preferred Solution for Long-Distance Transmission

25G BIDI 80km Optical Module - The Preferred Solution for Long-Distance Transmission

2026-09-16
25G SFP28 BIDI ZR 80km optical module: single-fiber, EML+SOA+PIN TIA, 80km reach, industrial temp. Cost-effective for base stations and metro networks.
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How To Distinguish Between DAC and ACC?

How To Distinguish Between DAC and ACC?

2026-09-14
How to distinguish DAC and ACC? Compare passive copper vs active Redriver copper cables for 800G data centers. Learn physical, label, and link-status identification methods.
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